| Features and benefits |
| 533/400 MHz system bus | Supports 533/400 MHz system bus for single processor configurations. |
| Support for up to 2 GB of DDR333/266/200 memory technology | Higher performance & flexibility. |
| Six USB 2.0 ports. Backwards compatible to USB 1.1 | High-speed USB 2.0 peripheral support. |
| Low power design | Advanced mobile power management. |
| AGP 4X interface | Enables over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D and video streams. |
| Enhanced Intel SpeedStep® Technology | Real-time dynamic switching of voltage and frequency between maximum performance and battery-optimized operation, based on CPU demand, for longer battery life. |
| Deeper sleep alert state | Dynamic power management mode operates at lower voltage than Deep sleep mode for longer battery life. |
| Ultra ATA/100 | Takes advantage of industry innovations in HDD features and performance. |
| Thin and small package technology | Intel® 852PM Chipset uses Intel's Flip-Chip Ball Grid Array (FCBGA) packaging that is excellent for reducing package size and improves the chipset cooling capability. |
| 533/400 MHz system bus | Supports 533/400MHz system bus for single processor configurations. |
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